Experimental study on flow and heat transfer characteristics of Single-Phase Immersion Liquid Cooling systems

To address the energy consumption issue in data centers, this study investigates the Single-Phase Immersion Liquid Cooling (SPILC) system by an experimental platform. The influential mechanisms of the coolant flow rate and chip power on the SPILC performance are analyzed. The results indicate that the heat transfer of chips located at inlet regions is more influenced by board layout than that of the chips at the outlet region. Moreover, the chip case temperature shows a trend of slight increase followed by a decrease as the flow rate increases. There exists a critical flow rate beyond which further increase does not significantly improve the SPILC performance. Additionally, the chip case temperature rises significantly with increasing power, and lower flow rates result in greater temperature increases. When the flow rate does not exceed 4.0 L/min, the chip power has almost no effect on the system pressure drop. Moreover, the influence of the flow rate on the power usage effectiveness of SPILC systems is significant when the total chip power is low, but this effect is greatly weakened as the chip power increases.