Research on semiconductor strain gage balance technology applied in shock tunnel
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摘要: 对于有效试验时间仅有十至几十毫秒的激波风洞，常规应变天平和压电天平无法满足高精度气动力测量要求。半导体应变计的应变灵敏度远大于常用的金属电阻应变计，但其温度系数比金属电阻应变计高出2个数量级。针对此问题，设计了温度自补偿的半导体应变计并应用于等强度梁试验，结果表明：温度自补偿能够有效改善半导体应变计的温度效应，可将温度漂移降低至0.2% FS。在此基础上，设计了一杆高频响六分量半导体应变天平，通过天平、支杆一体化等设计，将测力试验系统的一阶固有频率提升至100 Hz以上。天平静态校准结果表明：该天平的综合加载误差达到国军标合格指标，综合加载重复性达到国军标先进指标。激波风洞B-2标模测力验证试验结果表明：在有效试验时间内，该天平可获得一个周期以上的输出信号，风洞试验结果与气动手册参考值、CFD计算值吻合较好。Abstract: The conventional strain balance or piezoelectric balance cannot meet the requirements of high precision aerodynamic measurement in the shock tunnel, as the effective test time is very short. The strain sensitivity of the semiconductor strain gage is much higher than that of the foil strain gage, but its temperature coefficient is two orders of magnitude greater than that of the foil strain gage. This paper designed a temperature-self-compensation semiconductor strain gage, and applied it on equal strength beam experiments. The results show that the temperature self-compensation technology can effectively improve the temperature effect of the semiconductor strain gage, and the temperature drift of the semiconductor strain gage is reduced down to 0.2% FS after temperature compensation. In this paper, a six-components balance with high frequency response is designed for the shock tunnel, and the results of calibration show that the combining loading repeatability and combining loading error of the balance meet the requirements of the national military standards. The balance can acquire more than one signal during effective test time as the inherent frequency of the test system is more than 100 Hz, and the results of the shock tunnel test are in good agreement with reference values of the aerodynamic manual and CFD results.
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图 1 常规半导体应变计加工工艺
Figure 1. Fabrication process of traditional semiconductor strain gage
图 8 温度补偿后的输出
Figure 8. Semiconductor strain gage output after temperature compensation
表 1 应变计主要性能对比
Table 1. Characteristics of different strain gages
应变计类型 金属电阻应变计 常规半导体应变计 应变灵敏度系数 1.8~2.2 80~210 电阻温度系数/(℃-1) 2.0×10-5 (70~700)×10-5 温度范围/℃ －270~650 －30~150 
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表 2 天平设计载荷与设计应变
Table 2. The range and strain design of balance
天平分量 轴向力分量A 法向力分量N 侧向力分量C 滚转力矩分量L 偏航力矩分量Nb 俯仰力矩分量M 设计载荷/(N；N·m) 30 200 40 2 5 15 设计应变/με 10~50 10~50 10~50 10~50 10~50 10~50
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表 3 试验系统前六阶固有频率
Table 3. The first six mode frequencies of system
模态 一阶 二阶 三阶 四阶 五阶 六阶 频率/Hz 100 119 200 308 407 558 振型 侧向 法向 侧向 法向 滚转 侧向
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表 4 天平多元校准结果
Table 4. The results of multi-component calibration
天平分量 轴向力分量A 法向力分量N 侧向力分量C 滚转力矩分量L 偏航力矩分量Nb 俯仰力矩分量M 综合加载重复性/(% FS) 0.08 0.04 0.05 0.04 0.02 0.03 综合加载误差/(% FS) 0.15 0.22 0.34 0.48 0.16 0.04
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表 5 试验流场参数表
Table 5. Parameters of flow field
流场参数 数值 单位 来流马赫数Ma∞ 10.5 自由流动压q∞ 13 747 Pa 自由流单位雷诺数Re/L 5.97×106 m-1 自由流静压p∞ 174.56 Pa 自由流静温T∞ 46.73 K
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表 6 试验结果重复性精度
Table 6. The repeatability accuracy of results
天平分量 轴向力分量A 法向力分量N 俯仰力矩分量M 纵向压心系数Xcp 半导体应变天平/% 0.92 0.88 0.85 0.16 压电天平/% 4.01 1.51 1.60 0.58
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